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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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6 Years
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MCP package Substrate 0.5oz Copper Customize BT Material

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MCP package Substrate 0.5oz Copper Customize BT Material

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MCP package Substrate 0.5oz Copper Customize BT Material

MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is belong to HOREXS Group, is one of the leading ...

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Immersion Gold FR4 Substrate

      

0.5oz Copper MCP Substrate

      

MCP FR4 Substrate

      
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