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Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

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Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

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Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of chip by using wire-bonding through the central slot. ...

Product Tags:

BOC Package Substrate High Speed

      

High Density BOC Package Substrate

      

soft gold Chip Substrate

      
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