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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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6 Years

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FBGA/PBGA/LGA Package Semiconductor Substrate manufacture

HongRuiXing (Hubei) Electronics Co.,Ltd.
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FBGA/PBGA/LGA Package Semiconductor Substrate manufacture

Brand Name : Horexs

Model Number : HRX

Certification : UL

Place of Origin : CHINA

MOQ : 1 square meter

Price : US 120-150 per square meter

Payment Terms : Western Union, MoneyGram, T/T, L/C

Supply Ability : 30000 square meters per month

Delivery Time : 7-10 working days

Packaging Details : carton customized

Material : BT

Technology : tenting

Package type : BGA package

Line spec. : 45/45um

Layers : 4 layer

Surface finished : ENIG(Soft gold&Hard gold)/ENEPIG

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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless RF-Memory (DDR SDRAM)-Cell phone-Workstation, Server, Video Camera -Desktop PC, Note book PC,Wearable electronics,Car/automotive electronics;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.29mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:4 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK)

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrates,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)


Product Tags:

MEMS Semiconductor Substrate Boards

      

CMOS Semiconductor Substrate Boards

      

1mil MEMS Memory Substrate

      
Wholesale FBGA/PBGA/LGA Package Semiconductor Substrate manufacture from china suppliers

FBGA/PBGA/LGA Package Semiconductor Substrate manufacture Images

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