Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.29mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:4 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK)

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world .

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrates,please also provide us layer stack-up information;

Process Capability
Our Technology
• Fine pattern by MSAP(20/20um) and Tenting(30/30um)
• Various Applicable Technical Option
- Thin Core Technology
- All type Surface Finish
- SR Flatness Process, Build up / Via Filling Tech.
- Tailless, Etch-back Process
- Fine Pitch SOP process
• High Quality and Reliability Substrate
• High Speed Delivery : No need film, No outsourcing
• Competitive Low Running Cost

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Precision IC Packaging Substrate Fabrication

BT IC Substrate

Electrolytic Foil IC Substrate

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing Images